Package plays critical role for the performance and cost of RF Power product. By strategic cooperation with leading RF Power package suppliers in the world, Innogration is offering our products in form of broad package choices either standard off-shelf options or highly customized solutions

           Highlight

• Broadest choices including CuW, CPC, SCMC, Copper flanged

• Full body headers and lids, plated flange and mini pack product form

• Eared or Earless for customer preference

• Proven ,mainstream, high volume package from top suppliers

• Focus on epoxy lid sealing(with hermetical sealing optional for selective cases)

&Typical plastic package by SMT through grounding vias or directly on heatsink

   DFN overmolded: 4*4mm(PD), 4*4.5mm(P2),6*5mm(P3), 7*6.5mm(P5)

  QFN overmolded:7*7mm(P4),10*6mm(P6),8*8mm (P8) 

  QFN open cavity (Patent granted):10*6mm(C6), 12*10mm(C9)

&Typical Air Cavity Plastic Package with the same outline as its Air Cavity Plastic Package

  A2C (A2/AY2),B4C(BY4/B4),D4C(D4)

&Typical package for GaN IMFET

  H3:30*27mm, H2:24*17

Main Package Pictures: