Engineering Innogration
• Design
- Active, passive and MMIC die
- Parasitic extraction
- RF and EM simulation
- Application oriented internal matching topologies
- Custom design packaging mechanics and assembly process
- iModuleTM and MCM sub-system design
- Load-Pull for design optimization
- Device modeling
- Ruggedness and stability
• Complete release circle
- MPW to SPW
- DOE for performance and consistency
- Batch to batch yield verification
- Full reliability test
- Production board development
- Pre-production verification
- Product release
- Class AB/ Class C/Class F/Class J
- Wave shaping and harmonic tuning
- Linearity enhancement by DPD/APD
- Doherty (sym, asym, wideband)
- Ultra wide band and Multi Octave
- High power CW
- Mininature design