Sept 30, 2016, Suzhou China--- Innogration Technologies,a fabless RF Power semiconductor company, today announced the iModule concept to the market. iModule is based on direct chip on PCB bonding to leverage state-of-art technology, assembly, and application together. It can be either sole technology based or hybrid technologies based with flexible choice of carriers, and it provides the upmost performance and cost solution. As registered trademark globally, iModule also provides custom design and system integration flexibility. For more details or further cooperation, please reach us through marketing@innogration.net